Design of a complete 1 to 2 GHz PLL and serializer

For a world-leading advanced IC design center

Design of a complete 1 to 2 GHz PLL and serializer on Silterra130nm process

  • Top level sizing and design specification
  • Design of PFD, CP, loop filter, VCO, programmable dividers, prescalers, bias, bandgaps, temperature compensator;

Deliverables:

  • Design, layout and back-annotation;
  • Simulation reports;
  • Regular reviews and interaction with the Customer;
  • Support for integration
Customization of our LVDS transmitter cell

For a world-leading research center in nanoelectronics

Customization of our LVDS transmitter cell to customer specifications on Silterra130nm process;

  • Design transfer (including layout) of the existing LVDS cell in TSMC 40nm;
  • Re-design to accommodate to new specifications;
  • Extensive jitter simulations, including the effect of packages parasitics;

Deliverables:

  • Design, layout and back-annotation;
  • Simulation reports;
  • Regular reviews and interaction with the Customer;
  • Support for integration
Design of the first stage of an high-speed ADC 12b 500MHz

For a technology and chipset solutions provider in high performance imaging.

On TowerJazz 180nm process;

  • Pre-study;
  • Design and critical layout;
  • PEX for parasitic effects, including package;
  • Regular reporting to the Customer via Webex;
  • Final go to silicon.
Design service on radiation tolerance

For a manufacturer of integrated systems and sensors for nuclear power plant applications.

On XFAB 0.35µm process (XH035)

  • Consultancy and advisory on Radiation Hardening projects
  • Participation in various technical meetings (EU)
  • 1 senior designer
Design of various IP blocks for a medical application

For a world-leading advanced IC design center.

On TSMC 0.25µm and TSMC 0.18µm processes

  • Design, layout of various blocs for medical applications
  • Long term partnership
  • Two seniors designers
  • Top level integration and verification
  • Tape-out
Design of high temperature IPs

For a leading company in high temperature semiconductor solutions, delivering standard products and custom solutions for extreme temperature and harsh environments.

Design, layout of various blocs for high temperature

  • Long term partnership,
  • Up to 3 highly skilled analog designers,
  • XFAB XI10 SOI process,
  • Interface with Customer specific tool chain
Design service for automotive applications

For the automotive division of a large semiconductors supplier company,

Long term partnership

  • Large team of 6 designers or more,
  • Feasibility, design, layout of various blocs:
    • POR,
    • High precision bandgap,
    • Instrumentation op-amps,
    • Measurement interfaces,
    • Various communication protocols,
    • I/Os, etc.
  • Tape-outs and tests of chips
Design of two accelerometer chips and a power management chip

For a main leader company that designs and builds electrical systems for the aerospace, defence, transportation and security markets.

On XFAB 0.35um technology with HV option, two chip variants with

  • Test structure for DAC and ADC
  • Special low noise amplifiers
  • Special tests on capacitors
  • Test of a specific foundry-provided IP

A 29mm² die with more than 100 I/Os.

On XFAB 0.18um technology with HV option, a power management chip with

  • Bandgap and analog comparators
  • ADCs and DACs
  • Power switches & various protections
  • Digital control

Delivrables:

  • Design / layout progress reviews and reports;
  • Milestone review meetings;
  • Design / layout of all the blocks (including the IO ring);
  • Increased radiation tolerance by specific design techniques;
  • Top level design, mixed-mode simulations;
  • Tape-out;
  • Characterization vs Radiations;
  • From 2 to 4 highly skilled IC designers.
Radiation tolerance characterization of ICs

For a company providing high-performance micro-satellites for Earth observation applications.

Characterization of a chip radiation tolerance
  • Characterization for an existing device off the shelf;
  • Specifications of the radiation tolerance test campaign;
  • Development of the test setup and programs;
  • Execution of the test campaign (irradiation);
  • Analysis and report
Deliverables:
  • Specification of the tests to run;
  • Test programs and test hardware;
  • Tests execution, analysis and reporting;
  • Regular review meetings.