Design of two accelerometer chips and a power management chip

For a main leader company that designs and builds electrical systems for the aerospace, defence, transportation and security markets.

On XFAB 0.35um technology with HV option, two chip variants with

• Test structure for DAC and ADC
• Special low noise amplifiers
• Special tests on capacitors
• Test of a specific foundry-provided IP

A 29mm² die with more than 100 I/Os.

On XFAB 0.18um technology with HV option, a power management chip with

• Bandgap and analog comparators
• ADCs and DACs
• Power switches & various protections
• Digital control

Delivrables:

• Design / layout progress reviews and reports;
• Milestone review meetings;
• Design / layout of all the blocks (including the IO ring);
• Increased radiation tolerance by specific design techniques;
• Top level design, mixed-mode simulations;
• Tape-out;
• Characterization vs Radiations;
• From 2 to 4 highly skilled IC designers.